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mach-snapdragon: of_fixup: support new flat dwc3 node
authorCasey Connolly <casey.connolly@linaro.org>
Wed, 14 Jan 2026 13:57:32 +0000 (14:57 +0100)
committerCasey Connolly <casey.connolly@linaro.org>
Wed, 14 Jan 2026 15:25:09 +0000 (16:25 +0100)
commit9be4f2f5f4d0b8327befde42c743336fa63fc43b
tree64d6dba36065a03ec75296ccd1d11c3b2e4d88aetree | snapshot
parent338c4b820804323c9c02521df5796c82b6dc1e81commit | diff
mach-snapdragon: of_fixup: support new flat dwc3 node

Qualcomm DTs are being updated to use a new format where the dwc3 glue
node and controller are combined into a single DT node. Update the fixup
code to handle this case.

Reviewed-by: Neil Armstrong <neil.armstrong@linaro.org>
Link: https://patch.msgid.link/20260114135739.1546815-1-casey.connolly@linaro.org
Signed-off-by: Casey Connolly <casey.connolly@linaro.org>
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