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dt-bindings: thermal: qcom-tsens: Document the Shikra Temperature Sensor
authorGaurav Kohli <gaurav.kohli@oss.qualcomm.com>
Wed, 13 May 2026 07:30:58 +0000 (13:00 +0530)
committerDaniel Lezcano <daniel.lezcano@kernel.org>
Wed, 3 Jun 2026 07:12:21 +0000 (09:12 +0200)
commitfc4ad576cb836b0538d214b789adf7e89287fb78
tree578ee04196af666e744c0382594d5f516804d7f3tree | snapshot
parent4bb840492cedf89d5bed72ede6e0f8e848141977commit | diff
dt-bindings: thermal: qcom-tsens: Document the Shikra Temperature Sensor

Document the Temperature Sensor (TSENS) on the Shikra SoC.

Signed-off-by: Gaurav Kohli <gaurav.kohli@oss.qualcomm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Link: https://patch.msgid.link/20260513-tsens_binding-v1-1-1780c6a6caf2@oss.qualcomm.com
Documentation/devicetree/bindings/thermal/qcom-tsens.yaml diff | blob | blame | history
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